Shanghai University of Engineering Science, Shanghai, China, 2023.11.04
Forum introduction:
“Scientific Design International Forum was founded in September 2019. From the beginning, the forum has been committed to constructing an international platform, providing a foundation for interdisciplinary gatherings of researchers from China, Japan, Korea to encourage communication and presentations for academic research and latest design methods. In the previous years, the forum invited represented scholars and researchers from different countries to share their latest design methods in their specialized disciplines. The forum also welcomes young scholars and designers to join, and it provides a mini-forum for young speakers’ communication. The past two forum activities have received high recognition and achieved positive feedback from the participants. Due to the COVID-19, there were restrictions on on-site and in-person communication. In 2021, the 2nd Forum initiated the trial of a mixed mode of Web on-line and Local off-line, explored the possibilities of digital-forum, andgained valuable experience. In 2023, we plan to host the 4th Scientific Design International Forum on Saturday, November 4th at SUES’s Songjiang campus. The theme of this year’s forum is “DESIGN - CONNECTION”. We will invite pioneering scholars working in the design field to share the latest ideas, to show the most recent research methods, and to discuss the newest educational modes. Simultaneously, we will launch an open call for student poster presentation. The main contents include, but are not limited to, the following four categories: digital media design, text and graphic design, environment and space design, product design.
The forum will lay a solid foundation for the young scholars and researchers on international design communication and collaboration in the future. We sincerely invite all the experts, young designers and scholars to participate in the forum and to share your experiences with design thinking, design concepts and methods for achieving good designs.
Conference schedule
| Date | Contents | Location |
| 09：15-09：30 | Opening Ceremony | Songjiang Campus / On-line |
| 09：30-10：00 | Theme presentation① | |
| 10：00-10：30 | Theme presentation② | |
| 10：30-11：00 | Theme presentation③ | |
| 11：00-11：30 | Theme presentation④ | |
| Lunch break（90 min） | ||
| 13：00-15：00 | Special session | Songjiang Campus / On-line |
| 15：00-15：30 | Poster presentation awards / Closing Ceremony | |
# Indicated Time zone is GMT+8
Special session: [Positioning of future design disciplines and approaches to talent cultivation]
The evolution of contemporary design disciplines no longer adheres to traditional aesthetics. The interdisciplinary nature of design is becoming increasingly pronounced, and there is a rising societal demand for multifaceted design professionals. The rapid advancement of AI technology is accelerating this shift, instilling a strong sense of crisis and awareness among designers in traditional domains. As the cradle of nurturing design talent, how should the design discipline strategically plan its development? What are the drawbacks in the current educational systems across different countries? How should the position of design disciplines in the entire higher education system be defined? Additionally, how can we effectively cultivate versatile design professionals? These are just a few of the many challenges facing educators in the field of design. A special topic has been set up to address these questions, inviting design educators from universities around the world to engage in discussions and in-depth exchanges. “Where there is a gathering of collective strength, there is no defeat.” Experts and scholars from various countries are pooling their wisdom and insights, working together to contribute ideas and suggestions for positioning the future development of design disciplines and approaches to talent cultivation.
ORGANIZER：Shanghai University of Engineering Science
CO-ORGANIZERS：International Institute of Creative Design, Committee of National College Digital ART&Design Awards（NCDA）
MAIN SPONSORS: Korea: Dongseo University，Kongju National University；Pakistan：Pak-Austria Fachhochschule-Institute of Applied Sciences and Technology；Malaysia : Malaysia Multimedia University；Mexico: University of Monterrey（UDEM）；Japan: Chiba University ； UK: Brunel University London, etc.
Poster Presentation requirement: The forum will provide a standard poster display board for each participant (A0 for the poster size). Please provide a digital file to the committee when applying. The poster layout should have concise content and clear font, with the text being visible at least 1 meter away. Please refer to the attached template for specifics.
Poster Language: The Title, Abstract/Introduction and Author Information should be written in English. The main content is suggested to be written in English and the attendee's first language.
The forum does not charge a conference registration fee. The organizers will provide the venue and refreshments during the conference. Participants will need to cover their own transportation and accommodation expenses.
*Attachments：
The deadline for submission of posters is October 27, submissions should be submitted by email as requested below:
1) Email title: Author’s name + Affiliation, Nationality;
2) Poster digital file (Size: A0 in pdf format, Layout could be chosen from templates from Attachment 1, Poster should be named as “attendee’s name, Title (English + local language);
3) Registration/Contact email address: csdifsues@163.com.
Committee of Scientific Design International Forum
International Institute of Creative Design
Shanghai University of Engineering Science
2023.09
